Inventor · disambiguated record
Ya-Hui Wu
Also filed as: WU YA-HUI
3 granted patents·1 pending application·21 citations·filing 2004–2025
61Inventor score
Top patents by PatentIndex Score
4 records- 0182US2025351365A13d memory multi-stack connection methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0275US12426270B23D memory multi-stack connection methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 0374US7154750B2Printed circuit board having cooling means incorporated thereinDATECH TECHNOLOGY CO LTD·Filed 2004·Granted Dec 26, 2006·21 cites·5 claims
- 0467US11758733B23D memory multi-stack connection methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →