Inventor · disambiguated record
Yan Xun Xue
Also filed as: XUE YAN · XUE YAN XUN
140 granted patents·37 pending applications·401 citations·filing 2000–2025
99Inventor score
Files withZTE CORP31ALPHA & OMEGA SEMICONDUCTOR30SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD29XUE YAN XUN27ALPHA & OMEGA SEMICONDUCTOR INT LP16
Top patents by PatentIndex Score
177 records- 0197US10950155B1GOA circuit and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Mar 16, 2021·9 cites·18 claims
- 0296US11315460B1Gate electrode driving circuit and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Apr 26, 2022·7 cites·20 claims
- 0394US11688671B2Semiconductor package having a lead frame including die paddles and method of making the sameALPHA & OMEGA SEMICONDUCTOR INT LP·Filed 2021·Granted Jun 27, 2023·2 cites·9 claims
- 0494US11257411B2Gate driver on array (GOA) circuit and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Feb 22, 2022·4 cites·20 claims
- 0594US9653383B2Semiconductor device with thick bottom metal and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted May 16, 2017·15 cites·4 claims
- 0694US8642385B2Wafer level package structure and the fabrication method thereofXUE YAN XUN·Filed 2011·Granted Feb 4, 2014·22 cites·29 claims
- 0794US8581376B2Stacked dual chip package and method of fabricationYILMAZ HAMZA·Filed 2010·Granted Nov 12, 2013·22 cites·23 claims
- 0892US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 0991US8436429B2Stacked power semiconductor device using dual lead frame and manufacturing methodXUE YAN XUN·Filed 2011·Granted May 7, 2013·13 cites·10 claims
- 1090US11694618B2Pixel driving circuit and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Jul 4, 2023·3 cites·18 claims
- 1190US9397029B1Power semiconductor package device having locking mechanism, and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jul 19, 2016·7 cites·6 claims
- 1290US8952509B1Stacked multi-chip bottom source semiconductor device and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Feb 10, 2015·15 cites·15 claims
- 1390US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 1489US9754864B1Semiconductor power device having single in-line lead module and method of making the sameALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Sep 5, 2017·6 cites·10 claims
- 1589US9184117B2Stacked dual-chip packaging structure and preparation method thereofHO YUEH-SE·Filed 2012·Granted Nov 10, 2015·11 cites·18 claims
- 1689US8481368B2Semiconductor package of a flipped MOSFET and its manufacturing methodXUE YAN XUN·Filed 2011·Granted Jul 9, 2013·11 cites·5 claims
- 1788US12225556B2Adaptive data radio bearer mapping for multicast/broadcast in wireless networksZTE CORP·Filed 2022·Granted Feb 11, 2025·1 cites·20 claims
- 1887US9054091B2Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structuresYILMAZ HAMZA·Filed 2013·Granted Jun 9, 2015·6 cites·18 claims
- 1986US10742226B1Multi-channel high-precision ADC circuit with self-calibration of mismatch errorCHEN ZHENHAI·Filed 2019·Granted Aug 11, 2020·22 cites·10 claims
- 2086US9224679B2Wafer level chip scale package with exposed thick bottom metalALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Dec 29, 2015·6 cites·7 claims
- 2186US8642397B1Semiconductor wafer level package (WLP) and method of manufacture thereofGONG YUPING·Filed 2012·Granted Feb 4, 2014·9 cites·20 claims
- 2286US8575006B2Process to form semiconductor packages with external leadsXUE YAN XUN·Filed 2009·Granted Nov 5, 2013·14 cites·20 claims
- 2386US8178954B2Structure of mixed semiconductor encapsulation structure with multiple chips and capacitorsXUE YAN XUN·Filed 2010·Granted May 15, 2012·7 cites·12 claims
- 2485US11965227B1Metal ceramic and preparation method thereofCHONGYI ZHANGYUAN TUNGSTEN CO LTD·Filed 2023·Granted Apr 23, 2024·1 cites·5 claims
- 2585US11404006B2GOA circuit and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·16 claims
- 2685US8841167B1Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFETGONG YUPING·Filed 2013·Granted Sep 23, 2014·8 cites·8 claims
- 2785US8563361B2Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2012·Granted Oct 22, 2013·8 cites·8 claims
- 2885US8519520B2Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing methodGONG YUPING·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 2985US8338232B2Power semiconductor device package methodSHI LEI·Filed 2011·Granted Dec 25, 2012·8 cites·15 claims
- 3083US9214417B2Combined packaged power semiconductor deviceHO YUEH-SE·Filed 2014·Granted Dec 15, 2015·5 cites·6 claims
- 3182US8163601B2Chip-exposed semiconductor device and its packaging methodGONG YUPING·Filed 2010·Granted Apr 24, 2012·6 cites·11 claims
- 3281US8586414B2Top exposed package and assembly methodXUE YAN XUN·Filed 2010·Granted Nov 19, 2013·6 cites·17 claims
- 3381US8519525B2Semiconductor encapsulation and method thereofXUE YAN XUN·Filed 2010·Granted Aug 27, 2013·5 cites·9 claims
- 3481US8362606B2Wafer level chip scale packageALPHA & OMEGA SEMICONDUCTOR·Filed 2010·Granted Jan 29, 2013·5 cites·26 claims
- 3581US8344499B2Chip-exposed semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2012·Granted Jan 1, 2013·5 cites·4 claims
- 3680US9293397B1Power device and preparation method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Mar 22, 2016·3 cites·10 claims
- 3780US8716069B2Semiconductor device employing aluminum alloy lead-frame with anodized aluminumXUE YAN XUN·Filed 2012·Granted May 6, 2014·5 cites·9 claims
- 3879US11094617B2Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Aug 17, 2021·2 cites·17 claims
- 3979US8981539B2Packaged power semiconductor with interconnection of dies and metal clips on lead frameXUE YAN XUN·Filed 2013·Granted Mar 17, 2015·4 cites·14 claims
- 4078US11564084B2Information transmission method, device, and computer readable storage mediumZTE CORP·Filed 2019·Granted Jan 24, 2023·2 cites·17 claims
- 4178US9224669B2Method and structure for wafer level packaging with large contact areaXUE YAN XUN·Filed 2013·Granted Dec 29, 2015·3 cites·8 claims
- 4278US9171788B1Semiconductor package with small gate clip and assembly methodALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Oct 27, 2015·3 cites·12 claims
- 4378US8686546B2Combined packaged power semiconductor deviceHO YUEH-SE·Filed 2011·Granted Apr 1, 2014·5 cites·23 claims
- 4478US8283212B2Method of making a copper wire bond packageXUE YAN XUN·Filed 2010·Granted Oct 9, 2012·5 cites·12 claims
- 4578US8247288B2Method of integrating a MOSFET with a capacitorXUE YAN XUN·Filed 2010·Granted Aug 21, 2012·5 cites·23 claims
- 4678US8076183B2Method of attaching an interconnection plate to a semiconductor die within a leadframe packageXUE YAN XUN·Filed 2009·Granted Dec 13, 2011·7 cites·21 claims
- 4775US11107401B1Pixel driving circuit, driving method thereof, and display panelSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD·Filed 2020·Granted Aug 31, 2021·1 cites·10 claims
- 4875US8482048B2Metal oxide semiconductor field effect transistor integrating a capacitorXUE YAN XUN·Filed 2010·Granted Jul 9, 2013·4 cites·20 claims
- 4974US9196534B2Method for preparing semiconductor devices applied in flip chip technologyALPHA & OMEGA SEMICONDUCTOR·Filed 2013·Granted Nov 24, 2015·4 cites·16 claims
- 5074US8853003B2Wafer level chip scale package with thick bottom metal exposed and preparation method thereofXUE YAN XUN·Filed 2012·Granted Oct 7, 2014·3 cites·13 claims
Showing the top 50 of 177 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →