Inventor · disambiguated record
Yayong Yang
Also filed as: YANG YAYONG
2 granted patents·21 citations·filing 2022–2023
51Inventor score
Files withUNIV HUAZHONG SCIENCE TECH2
Top patents by PatentIndex Score
2 records- 0194US11976984B1Method and system for predicting junction temperature of power semiconductor module in full life cycle, and terminalUNIV HUAZHONG SCIENCE TECH·Filed 2023·Granted May 7, 2024·21 cites·5 claims
- 0243US12112110B2Multi-physics co-simulation method of power semiconductor modulesUNIV HUAZHONG SCIENCE TECH·Filed 2022·Granted Oct 8, 2024·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →