Inventor · disambiguated record
Yaw-Yuh Yang
Also filed as: YANG YAW-YUH
1 granted patent·4 pending applications·15 citations·filing 2002–2006
36Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
5 records- 0155US7122911B2Heat spreader and semiconductor device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·15 cites·17 claims
- 0244US2007087480A1Chip package methodADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0334US2004124515A1[chip package structure and method for manufacturing the same]Filed 2003·Application pending·0 cites
- 0425US2005104195A1Heat spreader and semiconductor device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 0518US2003128520A1Packaging structure with heat slugFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →