Inventor · disambiguated record
Yau-Ching Yang
Also filed as: YANG YAU-CHING
3 granted patents·1 pending application·0 citations·filing 2022–2023
45Inventor score
Files withGLOBALWAFERS CO LTD4
Top patents by PatentIndex Score
4 records- 0169US12420376B2Polishing head assembly having recess and capGLOBALWAFERS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 0266US12487185B2Systems and methods for processing semiconductor wafers using front-end processed wafer edge geometry metricsGLOBALWAFERS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 0365US12482662B2Systems and methods for producing epitaxial wafersGLOBALWAFERS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0444US2025001546A1Double-sided polishing of semiconductor wafers with dynamic controlGLOBALWAFERS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →