Inventor · disambiguated record
Yaping Zhou
Also filed as: ZHOU YAPING
21 granted patents·7 pending applications·233 citations·filing 2003–2024
94Inventor score
Top patents by PatentIndex Score
28 records- 0195US6998952B2Inductive device including bond wiresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 14, 2006·137 cites·26 claims
- 0291US8338948B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2010·Granted Dec 25, 2012·12 cites·2 claims
- 0389US7049694B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 23, 2006·15 cites·15 claims
- 0485US8399981B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2012·Granted Mar 19, 2013·6 cites·5 claims
- 0581US6992377B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jan 31, 2006·25 cites·16 claims
- 0680US8791372B2Reducing impedance discontinuity in packagesHARVEY PAUL M·Filed 2012·Granted Jul 29, 2014·4 cites·16 claims
- 0780US7203608B1Impedane measurement of chip, package, and board power supply system using pseudo impulse responseIBM·Filed 2006·Granted Apr 10, 2007·10 cites·20 claims
- 0878US8440917B2Method and apparatus to reduce impedance discontinuity in packagesHARVEY PAUL M·Filed 2007·Granted May 14, 2013·7 cites·13 claims
- 0976US8742565B2Ball grid array with improved single-ended and differential signal performanceWEEKLY ROGER D·Filed 2012·Granted Jun 3, 2014·3 cites·9 claims
- 1071US9831198B2Inductors for integrated voltage regulatorsNVIDIA CORP·Filed 2013·Granted Nov 28, 2017·3 cites·10 claims
- 1168US7256488B2Semiconductor package with crossing conductor assembly and method of manufactureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 14, 2007·3 cites·11 claims
- 1262US9306776B2Filtering high speed signalsNVIDIA CORP·Filed 2013·Granted Apr 5, 2016·2 cites·20 claims
- 1360US10685925B2Resistance and capacitance balancing systems and methodsNVIDIA CORP·Filed 2018·Granted Jun 16, 2020·1 cites·17 claims
- 1457US11600554B2Interconnection structures to improve signal integrity within stacked diesNVIDIA CORP·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1554US9843511B2Method and apparatus for selecting path from paths between label edge routersERICSSON TELEFON AB L M·Filed 2013·Granted Dec 12, 2017·1 cites·11 claims
- 1654US2025096773A1Bulk Acoustic Wave Resonance Assembly and Method for Manufacturing SameWUHAN MEMSONICS TECH CO LTD·Filed 2024·Application pending·0 cites
- 1752US8222739B2System to improve coreless package connectionsHARVEY PAUL M·Filed 2009·Granted Jul 17, 2012·0 cites·17 claims
- 1848US8338949B2System to improve coreless package connectionsHARVEY PAUL M·Filed 2012·Granted Dec 25, 2012·0 cites·13 claims
- 1948US6933599B2Electromagnetic noise shielding in semiconductor packages using caged interconnect structuresFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·3 cites·12 claims
- 2043US2008189090A1System and Method for Determining a Guard Band for an Operating Voltage of an Integrated Circuit DeviceAIKAWA MAKOTO·Filed 2007·Application pending·0 cites
- 2142US9270476B2Methods and apparatus for network protectionZHOU YAPING·Filed 2012·Granted Feb 23, 2016·0 cites·20 claims
- 2242US2023102044A1Bulk acoustic wave resonator and bulk acoustic wave filterWUHAN MEMSONICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 2341US8193800B2Voltage controlled on-chip decoupling capacitance to mitigate power supply noiseZHOU YAPING·Filed 2008·Granted Jun 5, 2012·1 cites·20 claims
- 2441US2010017158A1Generating worst case bit patterns for simultaneous switching noise (ssn) in digital systemsIBM·Filed 2008·Application pending·0 cites
- 2539US10600730B2Cross talk reduction differential cross over routing systems and methodsNVIDIA CORP·Filed 2018·Granted Mar 24, 2020·0 cites·17 claims
- 2639US2009302874A1Method and apparatus for signal probe contact with circuit board viasIBM·Filed 2008·Application pending·0 cites
- 2736US2012175763A1Integrated circuit packaging including auxiliary circuitryHARVEY PAUL M·Filed 2011·Application pending·0 cites
- 2835US2016072640A1Mac copy in nodes detecting failure in a ring protection communication networkYANG JUAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →