Inventor · disambiguated record

Ya Yun Zhu

Also filed as: ZHU YA YUN

1 granted patent·189 citations·filing 1999–1999

56Inventor score

Technology areasH10W

Files withHEWLETT PACKARD CO1

Top patents by PatentIndex Score

1 record

0191US6011314ARedistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumpsHEWLETT PACKARD CO·Filed 1999·Granted Jan 4, 2000·189 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →