Inventor · disambiguated record
Yeasir Arafat
Also filed as: ARAFAT YEASIR
0 granted patents·2 pending applications·0 citations·filing 2021–2025
Top patents by PatentIndex Score
2 records- 0148US2023091379A1First level interconnect under bump metallizations for fine pitch heterogeneous applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 0235US2025234341A1Method of transmitting data and electronic device for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →