Inventor · disambiguated record
Yea Rin Byun
Also filed as: BYUN YEA RIN
0 granted patents·2 pending applications·0 citations·filing 2022–2022
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0165US2023211456A1Polishing pad for chemical mechanical polishing, chemical mechanical polishing apparatus inluding the same, and method of fabricating semiconductor device using the chemical mechanical polishing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0254US2023193080A1Slurry compositions for polishing metal layers, chemical mechanical polishing apparatuses using the same, and methods for fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →