Inventor · disambiguated record
Yearin Byun
Also filed as: BYUN YEARIN
2 granted patents·7 pending applications·0 citations·filing 2021–2024
23Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0164US2023332015A1Slurry composition for polishing metal and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0261US2024189960A1Membrane coating compound for chemical mechanical polishing process, membrane including the same, and polishing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0357US12476114B2Chemical mechanical polishing method and method for fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0457US12319841B2Slurry composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·21 claims
- 0555US2024318040A1Chemical mechanical polishing slurry composition and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0653US2024318039A1Chemical mechanical polishing slurry and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0752US2024318038A1Method of manufacturing chemical mechanical polishing slurry and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0851US2024318037A1Slurry composition and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0948US2021403756A1Slurry composition for chemical mechanical polishingSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →