Inventor · disambiguated record

Yeou Chian Chang

Also filed as: CHANG YEOU CHIAN

1 granted patent·1 pending application·3 citations·filing 2020–2021

20Inventor score

Technology areasH10W

Files withNXP BV2

Top patents by PatentIndex Score

2 records

0183US11676885B2Semiconductor device packaging leadframe assembly and method thereforNXP BV·Filed 2021·Granted Jun 13, 2023·3 cites·18 claims
0236US2022189856A1Die attachment for semiconductor device packaging and method thereforNXP BV·Filed 2020·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →