Inventor · disambiguated record
Yenheng Chen
Also filed as: CHEN YENHENG
52 granted patents·17 pending applications·14 citations·filing 2018–2023
96Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP69
Top patents by PatentIndex Score
69 records- 0185US11316252B2Antenna packaging structure and method for forming the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 26, 2022·2 cites·16 claims
- 0282US11211687B2Method of fabricating a semiconductor structure with an antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 28, 2021·3 cites·5 claims
- 0376US11508675B2Semiconductor package structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Nov 22, 2022·3 cites·10 claims
- 0475US10714435B2Fan-out antenna packaging structure and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jul 14, 2020·2 cites·11 claims
- 0574US10777876B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·1 cites·4 claims
- 0673US10325786B1Double-sided plastic fan-out package structure having antenna and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jun 18, 2019·2 cites·9 claims
- 0770US11502392B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Nov 15, 2022·0 cites·9 claims
- 0868US11437707B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 0968US10770394B2Fan-out semiconductor packaging structure with antenna module and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 8, 2020·1 cites·15 claims
- 1067US11699840B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1164US11728558B2Semiconductor structure including antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Aug 15, 2023·0 cites·9 claims
- 1264US11605604B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Mar 14, 2023·0 cites·7 claims
- 1363US11488915B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·8 claims
- 1461US11283152B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 22, 2022·0 cites·9 claims
- 1560US11302658B2Fan-out antenna package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 12, 2022·0 cites·10 claims
- 1660US11289435B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 1760US10886594B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 1859US11257772B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Feb 22, 2022·0 cites·9 claims
- 1959US2024234235A9Thermally conductive semiconductor packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2058US2024063029A1Packaging structure having organic interposer layer and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2158US2024088000A1Fan-out system-level packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2258US2024088008A1Fan-out packaging unit used in pop packaging and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2358US2024088002A1System-level fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2458US2024047326A1Fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2557US10886243B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·5 claims
- 2657US2025372468A1Method for preparing three-dimensional stacked optoeletronic packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2757US2025286341A1Method for preparing optoelectronic integrated semiconductor packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2857US2024055416A1Wafer-level packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2956US2023352451A1Three-dimensional fan-out memory pop structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3056US2023352469A1Stacked memory pop structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3156US2023352461A1Three-dimensional fan-out memory package structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3256US2023386950A13d fan-out packaging structure of interconnection system with ultra-high density and method for manufacturing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3356US2023335514A1Fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3455US2023163114A1Three-dimensional fan-out integrated package structure, packaging method thereof, and wireless headsetSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Application pending·0 cites
- 3554US12482759B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·5 claims
- 3654US11894243B2Wafer system-level fan-out packaging structure and manufacturing methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Feb 6, 2024·0 cites·11 claims
- 3754US11211343B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 28, 2021·0 cites·10 claims
- 3854US11114391B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 7, 2021·0 cites·9 claims
- 3954US10804229B2Fan-out antenna package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Oct 13, 2020·0 cites·7 claims
- 4054US10573609B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Feb 25, 2020·0 cites·6 claims
- 4153US12283493B2Packaging structure radiating electromagnetic waves in horizontal direction and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Apr 22, 2025·0 cites·10 claims
- 4253US11228087B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 18, 2022·0 cites·10 claims
- 4353US10854951B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 1, 2020·0 cites·11 claims
- 4453US10777516B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·0 cites·7 claims
- 4552US12512411B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 30, 2025·0 cites·4 claims
- 4652US12113045B2Three-dimensional stacked fan-out packaging structure and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Oct 8, 2024·0 cites·18 claims
- 4752US12040546B2Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Jul 16, 2024·0 cites·10 claims
- 4852US11322852B2Lens antenna packaging structure, preparation method and electronic deviceSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted May 3, 2022·0 cites·16 claims
- 4951US12198942B2Packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jan 14, 2025·0 cites·10 claims
- 5051US12119295B2Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Oct 15, 2024·0 cites·8 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →