Inventor · disambiguated record
Yeong-Hwan Choe
Also filed as: CHOE YEONG-HWAN
2 granted patents·6 citations·filing 2015–2017
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0182US9721926B2Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 1, 2017·4 cites·27 claims
- 0269US10020290B2Semiconductor device having stacked semiconductor chips interconnected via TSVCHOE YEONG HWAN·Filed 2017·Granted Jul 10, 2018·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →