Inventor · disambiguated record
Yeow Chun Ricky Choo
Also filed as: CHOO YEOW CHUN RICKY
1 granted patent·1 pending application·0 citations·filing 2020–2021
3Inventor score
Files withTHALES DIS FRANCE SAS2
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2 records- 0142US2022288912A1Multilayer structure manufacturing method for bonding layers with adhesive film(s)THALES DIS FRANCE SAS·Filed 2020·Application pending·0 cites
- 0230US11989611B2Manufacturing method of a radio-frequency smart card with a metal inlay assemblyTHALES DIS FRANCE SAS·Filed 2021·Granted May 21, 2024·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →