Inventor · disambiguated record
Yen-Lin Chu
Also filed as: CHU YEN-LIN
6 granted patents·1 pending application·0 citations·filing 2004–2020
64Inventor score
Top patents by PatentIndex Score
7 records- 0155US9625218B2Method of manufacturing a heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Apr 18, 2017·0 cites·4 claims
- 0247US2020068745A1Heat dissipation structure of electronic deviceASIA VITAL COMPONENTS CO LTD·Filed 2018·Application pending·0 cites
- 0346US11564329B2Heat dissipation device with multiple heat dissipation zonesASIA VITAL COMPONENTS CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·10 claims
- 0446US9574830B2Mounting bracket for heat dissipation device having finsLIN SHENG-HUANG·Filed 2012·Granted Feb 21, 2017·0 cites·4 claims
- 0534US10021813B2Thermal module assembling structureASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·9 claims
- 0634US6998534B1Partition structure of a computer casingASIA VITAL COMPONENTS CO LTD·Filed 2004·Granted Feb 14, 2006·0 cites·2 claims
- 0733US8931972B2Thermal module mount structureCHU YEN-LIN·Filed 2009·Granted Jan 13, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →