Inventor · disambiguated record
Yechung Chung
Also filed as: CHUNG YECHUNG
8 granted patents·8 pending applications·28 citations·filing 2009–2024
81Inventor score
Top patents by PatentIndex Score
16 records- 0183US10304764B2Film product, film packages and package modules using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·5 cites·19 claims
- 0283US8350158B2Tape wiring substrates and packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 8, 2013·11 cites·13 claims
- 0378US8823185B2Semiconductor packagesO IN WON·Filed 2011·Granted Sep 2, 2014·9 cites·19 claims
- 0464US12412826B2Chip-on-film packages and display apparatuses including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 0561US2025166408A1Fingerprint sensor package and fingerprint authentication card including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0659US8198722B2Semiconductor packageCHO YOUNGSANG·Filed 2009·Granted Jun 12, 2012·3 cites·20 claims
- 0757US2025201725A1Fingerprint sensor package, fingerprint sensor package stacked structure and fingerprint authentication cardSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US11508651B2Chip-on-film packages and display apparatuses including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 0955US2025054825A1Semiconductor package and semiconductor assembly including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US2024162213A1Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US2025087562A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1253US2024014092A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1352US2024321902A1Chip-on-film package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1450US2025131230A1Fingerprint sensor package carrier and fingerprint sensor package assembly methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1547US11862548B2Package substrate film and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 1645US10741628B2Printed circuit boards including drive circuits, and related semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 11, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →