Inventor · disambiguated record
Yee Wai Fung
Also filed as: FUNG YEE WAI
1 granted patent·2 pending applications·7 citations·filing 2014–2016
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0177US9425130B2Package with multiple I/O side-solderable terminalsNXP BV·Filed 2014·Granted Aug 23, 2016·7 cites·13 claims
- 0235US2016126169A1Leadless semiconductor device and method of making thereofNXP BV·Filed 2014·Application pending·0 cites
- 0330US2018151482A1Electronic device, manufacturing method and lead frame for sameNexperia BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →