Inventor · disambiguated record
Ye Hong
Also filed as: HONG YE · HONG YE XIANG
7 granted patents·5 pending applications·127 citations·filing 2002–2024
86Inventor score
Top patents by PatentIndex Score
12 records- 0197US9436088B2Un-supported polymeric film with embedded microbeadsSEUL MICHAEL·Filed 2007·Granted Sep 6, 2016·47 cites·8 claims
- 0293US7335153B2Arrays of microparticles and methods of preparation thereofBIO ARRAY SOLUTIONS LTD·Filed 2002·Granted Feb 26, 2008·44 cites·12 claims
- 0391US7842649B2Quality control method for making a biochip displaying an encoded bead arrayBIOARRAY SOLUTIONS LTD·Filed 2007·Granted Nov 30, 2010·7 cites·10 claims
- 0488US9611507B2Arrays of microparticles and methods of preparation thereofBIOARRAY SOLUTIONS LTD·Filed 2014·Granted Apr 4, 2017·3 cites·18 claims
- 0587US7118900B2Directed assembly of functional heterostructuresBIOARRAY SOLUTIONS LTD·Filed 2002·Granted Oct 10, 2006·26 cites·16 claims
- 0674US2019024156A1Arrays of microparticles and methods of preparation thereofBIOARRAY SOLUTIONS LTD·Filed 2018·Application pending·0 cites
- 0771US10138511B2Arrays of microparticles and methods of preparation thereofBIOARRAY SOLUTIONS LTD·Filed 2017·Granted Nov 27, 2018·0 cites·1 claims
- 0867US2012220495A1Arrays of microparticles and methods of preparation thereofSEUL MICHAEL·Filed 2012·Application pending·0 cites
- 0966US2016369066A1Directed Assembly Of Functional HeterostructuresBIOARRAY SOLUTIONS LTD·Filed 2016·Application pending·0 cites
- 1064US2011098201A1Arrays of microparticles and methods of preparation thereofBIOARRAY SOLUTIONS LTD·Filed 2010·Application pending·0 cites
- 1162US12477730B2Electronic devices comprising segmented high-k dielectric materials and storage node materials, related systems, and methods of formingMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 1260US2025212413A1Electronic devices, related systems, and methods of formingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →