Inventor · disambiguated record
Yejie Hong
Also filed as: Hong Yejie
13 granted patents·17 pending applications·0 citations·filing 2020–2025
81Inventor score
Files withZHUHAI ACCESS SEMICONDUCTOR CO LTD27ZHUHAI YUEXIN SEMICONDUCTOR LLC2NANTONG ACCESS SEMICONDUCTOR CO LTD1
Top patents by PatentIndex Score
30 records- 0172US11769733B2Package substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·3 claims
- 0270US12040272B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·13 claims
- 0366US11682621B2Connector for implementing multi-faceted interconnectionZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·6 claims
- 0464US12230581B2Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·12 claims
- 0564US11503712B2Passive device packaging structure embedded in glass medium and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 0664US2025149461A1Multi-device graded embedding package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0763US11515258B2Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·9 claims
- 0862US2025112111A1Fan-out panel level packaging structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0961US12040526B2Method for manufacturing embedded package structure having air resonant cavityZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
- 1061US2025349463A1Embedding method and embedded structure for magnetic transformer, electronic device and storage mediumZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2024·Application pending·0 cites
- 1159US2024332224A1Embedded magnetic device integrated structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1258US2024321594A1Embedded magnet frame, integrated structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1358US2024312796A1Organic interposer structure, manufacturing method and package structure thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1456US2024063055A1Manufacturing method for device embedded packaging structureZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1555US2024096836A1Chip high-density interconnection package structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1655US2024116752A1Packaged cavity structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1754US12300576B2Cyclic cooling embedded packaging substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 13, 2025·0 cites·8 claims
- 1853US12278227B2Hybrid embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 1953US11903133B2Structure for embedding and packaging multiple devices by layer and method for manufacturing sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2053US2024222245A1Method for manufacturing embedded device packaging substrate, packaging substrate, and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024194578A1Embedded device package substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2252US2023127494A1Signal-heat separated tmv packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 2351US11961743B2Substrate manufacturing method for realizing three-dimensional packagingZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2451US2023154857A1Two-sided interconnected embedded chip packaging structure and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 2550US11342273B2Package structure of integrated passive device and manufacturing method thereof, and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted May 24, 2022·0 cites·7 claims
- 2650US2024153819A1Substrate manufacturing method, embedded substrate and semiconductorZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 2746US2024021525A1Packaging structure for realizing chip interconnection and manufacturing method thereofZHUHAI YUEXIN SEMICONDUCTOR LLC·Filed 2023·Application pending·0 cites
- 2845US12402414B2Capacitor and inductor embedded structure and manufacturing method therefor, and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Aug 26, 2025·0 cites·12 claims
- 2944US2024030146A1Multichip interconnecting packaging structure and manufacturing method thereofNANTONG ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 3044US2023199957A1Multilayer substrate and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →