Inventor · disambiguated record
Yeng Kwan Hoo
Also filed as: HOO YENG KWAN
0 granted patents·2 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0147US2024203938A1Integrated bare die package, and related fabrication methodsQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0240US2025096164A1Die package with guard structure to reduce or prevent material seepage into air cavity, and related fabrication methodsQUALCOMM TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →