Inventor · disambiguated record
Yeonho Jang
Also filed as: JANG YEONHO
13 granted patents·11 pending applications·11 citations·filing 2019–2024
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD24
Top patents by PatentIndex Score
24 records- 0196US11616051B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·4 cites·20 claims
- 0293US11145611B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·3 cites·19 claims
- 0392US11901276B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 13, 2024·1 cites·20 claims
- 0488US11456241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·18 claims
- 0579US11056461B2Method of manufacturing fan-out wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 6, 2021·1 cites·19 claims
- 0671US12087744B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 0771US11869835B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0870US2023420402A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0967US11637081B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 1061US12482721B2Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1160US11569157B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 1259US2025096179A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1358US11791295B2Semiconductor package with thick under-bump terminalSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·19 claims
- 1457US2025132218A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1556US2025062208A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1654US12261104B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 1754US2024178122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1854US2024088055A1Semiconductor package including alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024096773A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2054US2024096815A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2154US2024065002A1Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2252US2023026972A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2352US2024096777A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2445US11094636B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 17, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →