Inventor · disambiguated record

Yehya M. Kasem

Also filed as: KASEM YEHYA M

1 granted patent·110 citations·filing 1990–1990

53Inventor score

Technology areasH10W

Files withALLEGRO MICROSYSTEMS INC1

Top patents by PatentIndex Score

1 record

0182US5139973AMethod for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheetALLEGRO MICROSYSTEMS INC·Filed 1990·Granted Aug 18, 1992·110 cites·12 claims

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