Inventor · disambiguated record
Yeongseok Kim
Also filed as: KIM YEONGSEOK
17 granted patents·1 pending application·31 citations·filing 2015–2024
90Inventor score
Top patents by PatentIndex Score
18 records- 0192US10115613B2Method of fabricating a fan-out panel level package and a carrier tape film thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 30, 2018·5 cites·19 claims
- 0291US12183653B2Thermal conductive filmSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·2 cites·20 claims
- 0389US9922935B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 20, 2018·7 cites·18 claims
- 0485US10297554B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 21, 2019·4 cites·17 claims
- 0584US11355413B2Adhesive film, semiconductor apparatus using the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 7, 2022·4 cites·22 claims
- 0682US10551548B2Backlight unit and display apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Feb 4, 2020·3 cites·21 claims
- 0779US9418943B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 16, 2016·4 cites·14 claims
- 0873US9929131B2Method of fabricating a semiconductor package having mold layer with curved cornerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 27, 2018·2 cites·19 claims
- 0972US2024312826A1Processing tape and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1062US12374575B2Debonding tape and method of processing semiconductor wafer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1161US12040213B2Processing tape and method of fabricating a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·8 claims
- 1260US12062633B2Non-conductive film sheet and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 1355US10211163B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 19, 2019·0 cites·19 claims
- 1452US10147713B2Semiconductor package having mold layer with curved corner and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 4, 2018·0 cites·20 claims
- 1550US12057425B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 1648US11455980B2Vehicle and controlling method of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Sep 27, 2022·0 cites·18 claims
- 1748US10910339B2Flip chip bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 1848US10553546B2Semiconductor package and semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →