Inventor · disambiguated record
Yeongbeom Ko
Also filed as: KO YEONGBEOM
17 granted patents·11 pending applications·12 citations·filing 2010–2025
88Inventor score
Top patents by PatentIndex Score
28 records- 0182US2024387499A1Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0281US12051684B2Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 30, 2024·0 cites·16 claims
- 0381US12015005B2Semiconductor package including non-conductive film and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
- 0478US11764161B2Ground connection for semiconductor device assemblyMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 19, 2023·2 cites·8 claims
- 0578US11749665B2Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 5, 2023·0 cites·17 claims
- 0677US8546957B2Integrated circuit packaging system with dielectric support and method of manufacture thereofKO WONJUN·Filed 2010·Granted Oct 1, 2013·5 cites·20 claims
- 0776US2025379133A1Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0875US12451456B2Semiconductor package including non-conductive film and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
- 0975US11456289B2Face-to-face semiconductor device with fan-out porchMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 27, 2022·1 cites·17 claims
- 1068US12513973B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·10 claims
- 1165US12512429B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1264US12412824B2Semiconductor packages and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1364US11942455B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 26, 2024·0 cites·17 claims
- 1461US11362071B2Stacked semiconductor dies for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1561US2025183216A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1660US2025079249A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US8936969B2Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tapeLEE HUNTEAK·Filed 2012·Granted Jan 20, 2015·2 cites·24 claims
- 1859US8709877B2Integrated circuit packaging system with an encapsulation and method of manufacture thereofYANG DAEWOOK·Filed 2012·Granted Apr 29, 2014·1 cites·20 claims
- 1958US2024413026A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2057US2024421140A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2156US2023268229A1Methods of forming semiconductor dies with perimeter profiles for stacked die packagesMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 2255US12300667B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 2350US2023082884A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2449US2023082384A1Substrate processing apparatus and method of manufacturing semiconductor chip using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2549US2024047296A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2646US11621245B2Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 4, 2023·0 cites·15 claims
- 2745US2021202318A1Methods of forming semiconductor dies with perimeter profiles for stacked die packagesMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 2840US8716108B2Integrated circuit packaging system with ultra-thin chip and method of manufacture thereofLEE HUN TEAK·Filed 2012·Granted May 6, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →