Inventor · disambiguated record
Yeonjin Lee
Also filed as: LEE YEONJIN
18 granted patents·11 pending applications·10 citations·filing 2020–2025
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD29
Top patents by PatentIndex Score
29 records- 0191US11049827B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 29, 2021·3 cites·20 claims
- 0288US11670559B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·20 claims
- 0388US11476220B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·2 cites·20 claims
- 0487US12183660B2Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·1 cites·20 claims
- 0587US11587897B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0678US12080663B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0777US11817408B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 14, 2023·0 cites·20 claims
- 0874US2025062193A1Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0974US2025125225A1Semiconductor Device Including Via Structure And Method For Manufacturing The SameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1072US11557556B2Semiconductor devices including a thick metal layer and a bumpSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·20 claims
- 1172US2025300042A1Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1269US11948882B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1367US12199015B2Semiconductor device including via structure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·5 claims
- 1466US2025227920A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1565US12230587B2Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·6 claims
- 1665US11756843B2Semiconductor devices including scribe lane and method of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·7 claims
- 1764US12347747B2Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1864US11495533B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 1964US2025157948A1Semiconductor device with crack-preventing structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2062US11342235B2Semiconductor devices including scribe lane and method of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2158US2024282752A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2257US2024103070A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2356US12288734B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 2456US2024332228A1Semiconductor devices having upper conductive patterns and semiconductor packages having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US2024113077A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2652US2023138616A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2751US12072374B2Detection pad structure for analysis in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 2850US2024038675A1Semiconductor device and semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2945US11776894B2Semiconductor chip including low-k dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →