Inventor · disambiguated record
Yen-De Lee
Also filed as: LEE YEN-DE
4 granted patents·2 pending applications·3 citations·filing 2019–2023
60Inventor score
Files withWINBOND ELECTRONICS CORP6
Top patents by PatentIndex Score
6 records- 0194US11737380B2Resistive random access memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 22, 2023·3 cites·6 claims
- 0271US12063875B2Method for manufacturing resistive random access memory structureWINBOND ELECTRONICS CORP·Filed 2023·Granted Aug 13, 2024·0 cites·10 claims
- 0367US12087619B2Semiconductor device and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 10, 2024·0 cites·19 claims
- 0453US2021287934A1Semiconductor device and method of fabricating the sameWINBOND ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 0549US10978336B2Methods of manufacturing semiconductor devicesWINBOND ELECTRONICS CORP·Filed 2019·Granted Apr 13, 2021·0 cites·19 claims
- 0636US2019334084A1Resistive random access memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →