Inventor · disambiguated record
Yew San Lim
Also filed as: LIM YEW SAN
16 granted patents·6 pending applications·7 citations·filing 2018–2023
85Inventor score
Top patents by PatentIndex Score
22 records- 0181US10856454B2Electromagnetic interference (EMI) shield for circuit card assembly (CCA)INTEL CORP·Filed 2019·Granted Dec 1, 2020·3 cites·20 claims
- 0278US12061502B2Expandable thermal solution for laptopsINTEL CORP·Filed 2021·Granted Aug 13, 2024·1 cites·10 claims
- 0374US11596052B2Integrated voltage regulator for high performance devicesINTEL CORP·Filed 2020·Granted Feb 28, 2023·1 cites·15 claims
- 0474US10701796B2Electromagnetic interference (EMI) shieldINTEL CORP·Filed 2018·Granted Jun 30, 2020·2 cites·19 claims
- 0572US12393235B2Hinges for electronic devicesINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·17 claims
- 0668US12471262B2Radiation shield with radiation shield gapINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·19 claims
- 0762US12250800B2Radiation shield with zipperINTEL CORP·Filed 2021·Granted Mar 11, 2025·0 cites·20 claims
- 0861US11699664B2Wrappable EMI shieldsINTEL CORP·Filed 2020·Granted Jul 11, 2023·0 cites·15 claims
- 0956US11556157B2Diagonal printed circuit boards systemsINTEL CORP·Filed 2020·Granted Jan 17, 2023·0 cites·15 claims
- 1055US12309984B2Radiation shield and groove in support structureINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·19 claims
- 1154US11487326B2Elevated docking station for different mobile devicesINTEL CORP·Filed 2020·Granted Nov 1, 2022·0 cites·17 claims
- 1252US11589460B2System in package dual connectorINTEL CORP·Filed 2020·Granted Feb 21, 2023·0 cites·19 claims
- 1352US2025104941A1Electronic devices with tactile keyboards and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1451US12424779B2Flexible printed circuit board arrangementINTEL CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 1551US2023395480A1Substrate to board interconnect with liquid metal and surface pinsINTEL CORP·Filed 2022·Application pending·0 cites
- 1651US2024147654A1Laptop arrangement for heat controlINTEL CORP·Filed 2022·Application pending·0 cites
- 1751US2023317680A1Ribbon shield device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2023397323A1Package bottom side thermal solution with discrete hat-shaped copper spreader componentINTEL CORP·Filed 2022·Application pending·0 cites
- 1950US10939540B2Shielded folded circuit boardINTEL CORP·Filed 2019·Granted Mar 2, 2021·0 cites·24 claims
- 2048US11445608B2Chassis interconnect for an electronic deviceINTEL CORP·Filed 2020·Granted Sep 13, 2022·0 cites·21 claims
- 2144US11481001B2System for dual displaysINTEL CORP·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
- 2242US2020170113A1High density flexible interconnect design for multi-mode signalingSREERAMA CHAITANYA·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →