Inventor · disambiguated record
Yen-Miao Lin
Also filed as: LIN YEN-MIAO
2 granted patents·1 pending application·7 citations·filing 2013–2019
49Inventor score
Top patents by PatentIndex Score
3 records- 0186US10269669B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 0253US10872831B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 0346US2013270121A1Method for fabricating copper nanowire with high density twinsNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →