Inventor · disambiguated record
Yenfu Lin
Also filed as: LIN YENFU
1 granted patent·3 pending applications·0 citations·filing 2022–2024
11Inventor score
Top patents by PatentIndex Score
4 records- 0148US12470190B2Blackened wafers and method for manufacturing the same, and wave filter device having the sameFUJIAN JINGAN OPTOELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 0244US2025211200A1Elastic wave device, manufacturing method thereof, and electronic moduleQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0340US2024388274A1Bonding structure and acoustic wave deviceQUANZHOU SANAN INTEGRATED CIRCUIT CO LTD·Filed 2024·Application pending·0 cites
- 0435US2023188112A1Composite substrate of filter, method for making composite substrate of filter, and temperature compensated surface acoustic wave filterFUJIAN JINGAN OPTOELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →