Inventor · disambiguated record

Yen-Liang Lin

Also filed as: LIN YEN · LIN YEN-LIANG

107 granted patents·53 pending applications·291 citations·filing 2004–2025

99Inventor score

Technology areasH10W H10D H10F H10P H01L

Files withTAIWAN SEMICONDUCTOR MFG CO LTD132 TAIWAN SEMICONDUCTOR MFG7 LIN YEN-LIANG6 GEN ELECTRIC4 AMAZON TECH INC2

Top patents by PatentIndex Score

160 records

0199US10269773B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·45 cites·20 claims
0298US11855118B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
0397US11682655B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·3 cites·20 claims
0497US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
0597US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
0697US11227837B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·5 cites·20 claims
0797US9105530B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·22 cites·20 claims
0896US11784198B2Wide channel semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·2 cites·20 claims
0996US10790321B2CMOS image sensor having indented photodiode structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·6 cites·20 claims
1095US10566361B2Wide channel gate structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·8 cites·20 claims
1194US11532662B2Method of forming image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·2 cites·20 claims
1294US11183523B2CMOS image sensor having indented photodiode structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·4 cites·20 claims
1394US8853853B2Bump structuresCHANG CHIH-HORNG·Filed 2011·Granted Oct 7, 2014·24 cites·20 claims
1493US12087563B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·2 cites·20 claims
1593US10475174B2Visual anomaly detection systemGEN ELECTRIC·Filed 2017·Granted Nov 12, 2019·14 cites·13 claims
1693US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
1793US9646923B2Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted May 9, 2017·12 cites·20 claims
1893US9105533B2Bump structure having a single side recessTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 11, 2015·9 cites·20 claims
1992US10692826B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·8 cites·20 claims
2092US9190348B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·9 cites·20 claims
2191US11502039B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
2290US11189743B2Single photon avalanche diodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·19 claims
2390US9953939B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·4 cites·20 claims
2490US9953936B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·5 cites·14 claims
2590US9520379B2Method of forming bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 13, 2016·5 cites·20 claims
2689US10943942B2Image sensor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 9, 2021·2 cites·20 claims
2789US10784203B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
2889US9625365B2System and method for monitoring particles in solutionIND TECH RES INST·Filed 2015·Granted Apr 18, 2017·5 cites·19 claims
2989US2025357407A1Upper conductive structure having multilayer stack to decrease fabrication costs and increase performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3088US11645693B1Complementary consumer item selectionAMAZON TECH INC·Filed 2020·Granted May 9, 2023·2 cites·13 claims
3188US10163844B2Semiconductor device having conductive bumps of varying heightsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·5 cites·20 claims
3288US9893107B2Semiconductor device with reduced leakage current and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 13, 2018·6 cites·20 claims
3387US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
3487US12218173B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
3587US11942433B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·20 claims
3686US12261092B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·1 cites·20 claims
3785US12288729B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·20 claims
3885US9318458B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Apr 19, 2016·3 cites·20 claims
3984US12457816B2Wide channel semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
4084US11018179B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 25, 2021·1 cites·20 claims
4183US10950519B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
4282US10971477B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·19 claims
4382US10833033B2Bump structure having a side recess and semiconductor structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·2 cites·20 claims
4482US2024404975A1Upper conductive structure having multilayer stack to decrease fabrication costs and increase performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4581US11935804B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
4681US11456263B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·1 cites·20 claims
4781US9583367B2Methods and apparatus for bump-on-trace chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·3 cites·20 claims
4881US2025338650A1Image sensor and method of manufacturing image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4980US12424579B2Integrated chip including an upper conductive structure having multilayer stack to decrease fabrication costs and increase performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
5080US12040283B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims

Showing the top 50 of 160 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →