Inventor · disambiguated record
Yen-Ling Lin
Also filed as: LIN YEN-LING
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Files withBENQ MATERIALS CORP4
Top patents by PatentIndex Score
4 records- 0173US2025297139A1Water-based hot-melt adhesive and medical paper coating with water-based hot melt adhesiveBENQ MATERIALS CORP·Filed 2024·Application pending·0 cites
- 0272US2025154383A1Water-based hot melt adhesive and nonwoven coated with the water-based hot melt adhesiveBENQ MATERIALS CORP·Filed 2024·Application pending·0 cites
- 0363US2025154384A1Water-based hot-melt adhesive and nonwoven coated with the water-based hot-melt adhesiveBENQ MATERIALS CORP·Filed 2024·Application pending·0 cites
- 0460US2025154382A1Gas-permeable hot-melt sealing film for healthcare packagingBENQ MATERIALS CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →