Inventor · disambiguated record
Yee-Bing Ling
Also filed as: LING YEE-BING
3 granted patents·1 pending application·0 citations·filing 2017–2019
40Inventor score
Top patents by PatentIndex Score
4 records- 0142US10455704B2Method for copper filling of a hole in a component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Oct 22, 2019·0 cites·15 claims
- 0242US10433415B2Component carrier comprising a copper filled mechanical drilled multiple-diameter boreAT & S CHINA CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·12 claims
- 0333US2020006135A1Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component CarrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
- 0429US11166385B2Component carrier having a laser via and method of manufacturingAT & S CHINA CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Yee-Bing Ling files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →