Inventor · disambiguated record
Yew-Guan Low
Also filed as: LOW YEW-GUAN
2 granted patents·3 pending applications·2 citations·filing 2012–2018
38Inventor score
Top patents by PatentIndex Score
5 records- 0166US10227509B2Hot melt adhesive composition for bookbindingHENKEL AG & CO KGAA·Filed 2016·Granted Mar 12, 2019·1 cites·15 claims
- 0257US8877305B2Low application temperature hot melt adhesivePATEL JAGRUTI B·Filed 2012·Granted Nov 4, 2014·1 cites·13 claims
- 0345US2018230341A1Damping hot melt compositionHENKEL AG & CO KGAA·Filed 2018·Application pending·0 cites
- 0441US2018247632A1Damping hot melt compositionHENKEL AG & CO KGAA·Filed 2018·Application pending·0 cites
- 0536US2016379615A1Acoustic damping compositionHENKEL AG & CO KGAA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →