Inventor · disambiguated record
Yeow Chon Ong
Also filed as: ONG YEOW CHON
5 granted patents·7 pending applications·0 citations·filing 2021–2025
60Inventor score
Files withMICRON TECHNOLOGY INC12
Top patents by PatentIndex Score
12 records- 0175US2025349748A1Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0270US2025336737A1Semiconductor devices with flexible spacerMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0369US12368113B2Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0466US12362247B2Semiconductor devices with flexible spacer including a support structure and methods of making the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·17 claims
- 0562US12506134B2Fan-out packaging for a multichip packageMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·24 claims
- 0658US12080616B2Reinforced semiconductor device packaging and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 3, 2024·0 cites·15 claims
- 0756US2025096046A1Structure for testing interfacial adhesion between mold compound and vertical edges of a semiconductor dieMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0855US2024292522A1Microelectronic device package assemblies including stiffener devices, and related microelectronic devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0952US12438113B2Conductive adhesive assembly for semiconductor die attachmentMICRON TECHNOLOGY INC·Filed 2022·Granted Oct 7, 2025·0 cites·25 claims
- 1049US2025379066A1Systems and methods for reducing gaps around surface mount devices in stacked semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1148US2024038704A1Hybrid semiconductor device assembly interconnection pillars and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1246US2024063141A1Solder joint design for improved package reliabilityMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →