Inventor · disambiguated record
Yeong-Lyeol Park
Also filed as: PARK YEONG LYEOL
12 granted patents·4 pending applications·66 citations·filing 2007–2023
89Inventor score
Top patents by PatentIndex Score
16 records- 0193US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 0283US9559002B2Methods of fabricating semiconductor devices with blocking layer patternsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 31, 2017·4 cites·17 claims
- 0383US8841754B2Semiconductor devices with stress relief layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·8 cites·16 claims
- 0481US9293415B2Semiconductor devices including protection patterns and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 22, 2016·4 cites·20 claims
- 0581US8890282B2Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·20 claims
- 0677US9087885B2Method of fabricating semiconductor devices having through-silicon via (TSV) structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 21, 2015·6 cites·16 claims
- 0771US9147640B2Semiconductor devices having back side bonding structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 29, 2015·3 cites·17 claims
- 0871US8836109B2Semiconductor device and method of manufacturing a semiconductor deviceYUN KI-YOUNG·Filed 2012·Granted Sep 16, 2014·9 cites·15 claims
- 0964US7705621B2Test pattern and method of monitoring defects using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 27, 2010·3 cites·7 claims
- 1056US9437554B2Semiconductor package having magnetic substance and related equipmentJI SANG-WOOK·Filed 2014·Granted Sep 6, 2016·2 cites·14 claims
- 1155US8729684B2Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the samePARK YEONG-LYEOL·Filed 2011·Granted May 20, 2014·1 cites·10 claims
- 1255US7801636B2Method and system for managing wafer processingSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 21, 2010·1 cites·26 claims
- 1354US2023298969A1Cooling apparatus, semiconductor device including the apparatus, and manufacturing method therofKOOLMICRO INC·Filed 2023·Application pending·0 cites
- 1450US2014225113A1Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1540US2015137388A1Semiconductor devicesKIM EUN-JI·Filed 2014·Application pending·0 cites
- 1638US2013052760A1Method of inspecting and manufacturing a stack chip packageCHO SUNG-DONG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →