Inventor · disambiguated record
Yean Ling Soon
Also filed as: SOON YEAN LING
1 granted patent·2 pending applications·0 citations·filing 2020–2023
3Inventor score
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0149US2025087542A1Package Substrates with Corner Stiffeners ExtensionsINTEL CORP·Filed 2023·Application pending·0 cites
- 0246US2023420379A1Integrated circuit package with pseudo-stripline architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 0336US11456516B2Low loss high-speed interconnectsINTEL CORP·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →