Inventor · disambiguated record
Yen-Chu Tu
Also filed as: TU YEN-CHU
1 granted patent·1 pending application·1 citations·filing 2022–2025
17Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
2 records- 0184US12355001B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·19 claims
- 0271US2025316645A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →