Inventor · disambiguated record
Yekan Wang
Also filed as: WANG YEKAN
2 granted patents·8 pending applications·0 citations·filing 2019–2024
27Inventor score
Top patents by PatentIndex Score
10 records- 0160US11634834B2Diamond on nanopatterned substrateUS GOV SEC NAVY·Filed 2021·Granted Apr 25, 2023·0 cites·7 claims
- 0256US2025391717A1Microelectronic assemblies with stacks of glass layersINTEL CORP·Filed 2024·Application pending·0 cites
- 0356US2025391715A1Microelectronic assemblies with glass cores with outer frames and metal pillarsINTEL CORP·Filed 2024·Application pending·0 cites
- 0455US2025374426A1Automated manufacturing of hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0555US2025144857A1Molding system and molding methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0653US2025391720A1Integrated circuit packages including substrates with encapsulated glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0753US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 0853US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 0952US11131039B2Diamond on nanopatterned substrateUS GOV SEC NAVY·Filed 2019·Granted Sep 28, 2021·0 cites·7 claims
- 1052US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →