Inventor · disambiguated record
Yee-Wen Yen
Also filed as: YEN YEE-WEN
4 granted patents·6 pending applications·3 citations·filing 2007–2019
59Inventor score
Top patents by PatentIndex Score
10 records- 0181US12030139B2Sn—Cu mixed alloy solder paste, method of making the same and soldering methodBOSCH GMBH ROBERT·Filed 2019·Granted Jul 9, 2024·1 cites·14 claims
- 0258US9233521B2Tin whisker mitigation material using thin film metallic glass underlayerUNIV NAT TAIWAN SCIENCE TECH·Filed 2013·Granted Jan 12, 2016·2 cites·1 claims
- 0355US2010132978A1Whisker-free coating structure and method of fabricating the sameUNIV NAT TAIWAN SCIENCE TECH·Filed 2009·Application pending·0 cites
- 0446US2014144554A1Ternary-Alloy Metallic Glass and Method for Making the SameUNIV NAT TAIWAN SCIENCE TECH·Filed 2012·Application pending·0 cites
- 0537US8246765B2Method for inhibiting growth of tin whiskersYEN YEE-WEN·Filed 2010·Granted Aug 21, 2012·0 cites·11 claims
- 0636US8956473B2Method for manufacturing Ni/In/Sn/Cu multilayer structureUNIV NAT TAIWAN SCIENCE TECH·Filed 2012·Granted Feb 17, 2015·0 cites·10 claims
- 0733US2013048153A1High-Temperature Solder with Multi-Layer Structure and Manufacturing Method ThereofYEN YEE-WEN·Filed 2011·Application pending·0 cites
- 0832US2011097498A1Method for inhibiting growth of tin whiskersUNIV NAT TAIWAN SCIENCE TECH·Filed 2010·Application pending·0 cites
- 0930US2012177945A1Whisker-Free Coating Structure and Method for Fabricating the SameYEN YEE-WEN·Filed 2012·Application pending·0 cites
- 1029US2008166835A1Method of bonding a solder ball and a base plate and method of manufacturing packaging structure of using the sameUNIV NAT TAIWAN SCIENCE TECH·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →