Inventor · disambiguated record
Yeon Seop Yu
Also filed as: YU YEON-SEOP
1 granted patent·6 pending applications·0 citations·filing 2013–2016
9Inventor score
Files withSAMSUNG ELECTRO MECH7
Top patents by PatentIndex Score
7 records- 0153US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0247US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 0341US9386701B2Electronic component embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 5, 2016·0 cites·15 claims
- 0439US2015366066A1Substrate with electronic device embedded therein and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0530US2017365567A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 0626US2016219713A1Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 0722US2016234941A1Printed circuit board, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →