Inventor · disambiguated record
Yeojun Yun
Also filed as: YUN YEOJUN
0 granted patents·14 pending applications·0 citations·filing 2023–2025
Files withJCET STATS CHIPPAC KOREA LTD14
Top patents by PatentIndex Score
14 records- 0162US2025391776A1Semiconductor Device and Method of Making Advanced Chiplet Bridge Die with CarrierJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0261US2025329662A1Semiconductor Device and Method of Forming Stacked SIP Structure with Single-Sided MoldJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0361US2025329681A1Semiconductor Device and Method of Making an ETS or Chiplet with Double-Sided Bridge DieJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0461US2025385103A1Semiconductor Device and Method of Making Using Microwave SolderingJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0560US2025391719A1Semiconductor Device and Method of Using CTAB to Reduce Occurrence of EM Dendrite Short-Circuit Between Interconnect StructuresJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0657US2025329547A1Semiconductor device and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0756US2025132211A1Semiconductor Device and Method of Forming Flexible Encapsulant Over Thin Electrical ComponentJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 0854US2025364275A1Method and apparatus for forming semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0954US2025323208A1Method for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1053US2025273480A1Semiconductor device with improved heat dissipation and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1152US2025309031A1Semiconductor device and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1250US2025266391A1Laser assisted bonding methodJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1349US2025246477A1Electronic package and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1443US2025246576A1Electronic device and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →