Inventor · disambiguated record
Yh Heng
Also filed as: HENG YH
2 granted patents·1 pending application·22 citations·filing 2013–2021
53Inventor score
Technology areasH10W
Files withSTMICROELECTRONICS SDN BHD3
Top patents by PatentIndex Score
3 records- 0186US9679832B1Rough leadframe with a nanolayer of silverSTMICROELECTRONICS SDN BHD·Filed 2016·Granted Jun 13, 2017·22 cites·20 claims
- 0243US11862540B2Mold flow balancing for a matrix leadframeSTMICROELECTRONICS SDN BHD·Filed 2021·Granted Jan 2, 2024·0 cites·10 claims
- 0332US2015001697A1Selective treatment of leadframe with anti-wetting agentSTMICROELECTRONICS SDN BHD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →