Inventor · disambiguated record
Yin Kheng Au
Also filed as: AU YIN KHENG
4 granted patents·10 pending applications·5 citations·filing 2010–2015
62Inventor score
Top patents by PatentIndex Score
14 records- 0156US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 0256US8853840B2Semiconductor package with inner and outer leadsAU YIN KHENG·Filed 2013·Granted Oct 7, 2014·3 cites·11 claims
- 0343US9257403B2Copper ball bond interface structure and formationFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Feb 9, 2016·0 cites·20 claims
- 0443US2015097278A1Surface mount semiconductor device with additional bottom face contactsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 0541US2015303169A1Systems and methods for multiple ball bond structuresTRAN TU-ANH N·Filed 2014·Application pending·0 cites
- 0633US2014110461A1System and method for cleaning bond wireIBRAHIM MOHD RUSLI·Filed 2012·Application pending·0 cites
- 0731US2011204498A1Lead frame and semiconductor package manufactured therewithFREESCALE SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 0830US2014374892A1Lead frame and semiconductor device using sameLEE YIT MENG·Filed 2013·Application pending·0 cites
- 0930US2014263584A1Wire bonding apparatus and methodYAP JIA LIN·Filed 2013·Application pending·0 cites
- 1029US2015075849A1Semiconductor device and lead frame with interposerYAP JIA LIN·Filed 2013·Application pending·0 cites
- 1129US2014374467A1Capillary bonding tool and method of forming wire bondsYAP JIA LIN·Filed 2013·Application pending·0 cites
- 1228US2015206829A1Semiconductor package with interior leadsAU YIN KHENG·Filed 2014·Application pending·0 cites
- 1327US2017062311A1Integrated circuit with on-die power distribution barsFREESCALE SEMICONDUCTOR INC·Filed 2015·Application pending·0 cites
- 1425US8450841B2Bonded wire semiconductor deviceONG LI TING CELINA·Filed 2011·Granted May 28, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →