Inventor · disambiguated record
Yi-Hua Chang
Also filed as: CHANG YI-HUA · CHANG YI-HUA E
19 granted patents·6 pending applications·163 citations·filing 1983–2025
93Inventor score
Top patents by PatentIndex Score
25 records- 0189US11356012B2Transmission and distribution system with electric shock protection function and method of operating the sameDELTA ELECTRONICS INC·Filed 2020·Granted Jun 7, 2022·2 cites·16 claims
- 0288US4639919ADistributed pattern generatorIBM·Filed 1983·Granted Jan 27, 1987·61 cites·19 claims
- 0385US12200889B2Power supply device with stacked circuit boards and thermal gel contacting magnetic memberDELTA ELECTRONICS INC·Filed 2022·Granted Jan 14, 2025·1 cites·11 claims
- 0478US9971060B2Sensor capable of detecting wide-range ambient signals and ensuring proximity sensing accuracy and method for fabricating the sameSENSORTEK TECH CORP·Filed 2016·Granted May 15, 2018·5 cites·3 claims
- 0578US6469560B1Electrostatic discharge protective circuitFARADAY TECH CORP·Filed 2001·Granted Oct 22, 2002·23 cites·4 claims
- 0675US6538868B2Electrostatic discharge protective circuitFARADAY TECH CORP·Filed 2002·Granted Mar 25, 2003·19 cites·5 claims
- 0774US6462601B1Electrostatic discharge protection circuit layoutFARADAY TECH CORP·Filed 2001·Granted Oct 8, 2002·21 cites·12 claims
- 0869US2025202372A1Isolated resonant dc-dc converterDELTA ELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0967US7603598B2Semiconductor device for testing semiconductor process and method thereofFARADAY TECH CORP·Filed 2007·Granted Oct 13, 2009·7 cites·17 claims
- 1066US9865765B2Package structure with optical barrier, optical package structure and manufacturing methods thereofSENSORTEK TECH CORP·Filed 2015·Granted Jan 9, 2018·2 cites·13 claims
- 1165US9140600B2Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2013·Granted Sep 22, 2015·2 cites·12 claims
- 1260US6744610B2Electrostatic discharge protection circuitFARADAY TECH CORP·Filed 2001·Granted Jun 1, 2004·9 cites·7 claims
- 1358US12490351B2Dimming circuit and method for use in dimming controlRICHTEK TECHNOLOGY CORP·Filed 2023·Granted Dec 2, 2025·0 cites·22 claims
- 1455US12402431B2Complex sensing device packaging structure and packaging methodSENSORTEK TECH CORP·Filed 2021·Granted Aug 26, 2025·0 cites·1 claims
- 1553US7050282B2Power supply clamp circuitFARADAY TECH CORP·Filed 2003·Granted May 23, 2006·6 cites·11 claims
- 1650US11956888B2Electronic device and grounding assembly thereofDELTA ELECTRONICS INC·Filed 2021·Granted Apr 9, 2024·0 cites·6 claims
- 1749US11056607B2Complex sensing device packaging structure and packaging methodSENSORTEK TECH CORP·Filed 2019·Granted Jul 6, 2021·0 cites·11 claims
- 1847US10069298B2Inverter and control method thereofDELTA ELECTRONICS INC·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
- 1947US2022140172A1Light sensing device packaging structure and packaging method thereofSENSORTEK TECH CORP·Filed 2021·Application pending·0 cites
- 2042US6703700B2Semiconductor packaging structureFiled 2001·Granted Mar 9, 2004·5 cites·9 claims
- 2140US9812854B2Power supply device and high potential test method thereofDELTA ELECTRONICS INC·Filed 2016·Granted Nov 7, 2017·0 cites·12 claims
- 2240US2015357505A1Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2015·Application pending·0 cites
- 2333US2004178483A1Method of packaging a quad flat no-lead semiconductor and a quad flat no-lead semiconductorFiled 2003·Application pending·0 cites
- 2427US2004130007A1Flat lead package for a semiconductor deviceFiled 2003·Application pending·0 cites
- 2524US2004089926A1Ultra thin semiconductor deviceTAIWAN IC PACKAGING CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →