Inventor · disambiguated record
Ying-Ju Chen
Also filed as: CHEN YING · CHEN YING-JU
173 granted patents·50 pending applications·706 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD136TAIWAN SEMICONDUCTOR MFG22UNIV CHUNG YUAN CHRISTIAN12CHEN YING-JU8CHEN HSIEN-WEI7
Top patents by PatentIndex Score
223 records- 0199US11315855B2Package structure with photonic die and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·11 cites·20 claims
- 0299US10504852B1Three-dimensional integrated circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·45 cites·19 claims
- 0398US11908692B2Method for fabricating a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·4 cites·20 claims
- 0498US11362066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·5 cites·20 claims
- 0598US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 0698US10157867B1Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·39 cites·20 claims
- 0798US10074618B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·19 cites·20 claims
- 0898US9196586B2Semiconductor package including an embedded surface mount device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 24, 2015·52 cites·20 claims
- 0997US11862599B2Bonding to alignment marks with dummy alignment marksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·3 cites·20 claims
- 1097US11362064B2Semiconductor package with shared barrier layer in redistribution and viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 1197US11309291B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 1297US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 1397US10629560B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·12 cites·20 claims
- 1497US9490192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·21 cites·20 claims
- 1596US10262952B2Ring structures in device dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 16, 2019·13 cites·20 claims
- 1696US10181449B1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·10 cites·20 claims
- 1796US9589938B2Semiconductor device including an embedded surface mount device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·12 cites·20 claims
- 1895US10157892B1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·11 cites·20 claims
- 1995US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 2095US9831215B1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·13 cites·20 claims
- 2195US8581400B2Post-passivation interconnect structureLIANG SHIH-WEI·Filed 2011·Granted Nov 12, 2013·22 cites·20 claims
- 2295US8405211B2Bump pad structureTSAI HAO-YI·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 2394US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 2494US10720385B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·7 cites·20 claims
- 2593US10797001B2Three-dimensional integrated circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 6, 2020·7 cites·19 claims
- 2693US8723325B2Structure and method of forming a pad structure having enhanced reliabilityCHEN HSIEN-WEI·Filed 2010·Granted May 13, 2014·15 cites·28 claims
- 2792US9793245B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·6 cites·20 claims
- 2892US9349665B2Methods and apparatus of packaging of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 24, 2016·14 cites·20 claims
- 2991US10651131B2Supporting InFO packages to reduce warpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 12, 2020·4 cites·20 claims
- 3091US10032712B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 24, 2018·9 cites·20 claims
- 3191US9852998B2Ring structures in device dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 26, 2017·10 cites·20 claims
- 3291US9842788B2Underfill control structures and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 12, 2017·6 cites·20 claims
- 3391US9490203B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 8, 2016·5 cites·20 claims
- 3491US9391028B1Integrated circuit dies having alignment marks and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 12, 2016·7 cites·20 claims
- 3591US8907478B2Bump pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 9, 2014·9 cites·20 claims
- 3690US11495559B2Integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 3790US9245842B2Semiconductor devices having guard ring structure and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 26, 2016·10 cites·20 claims
- 3890US8618827B2Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor deviceSHAO TUNG-LIANG·Filed 2010·Granted Dec 31, 2013·12 cites·20 claims
- 3990US2024395792A1Semiconductor device packages, packaging methods, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4089US11705343B2Integrated circuit package and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 4189US10163807B2Alignment pattern for package singulationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
- 4289US9570418B2Structure and method for package warpage control using dummy interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·9 cites·20 claims
- 4389US9269682B2Method of forming bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·10 cites·19 claims
- 4489US9196529B2Contact pad for semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 24, 2015·7 cites·20 claims
- 4588US11355468B2Structure and method of forming a joint assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 7, 2022·3 cites·20 claims
- 4688US10163866B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MNAUFACTRUING COMPANY LTD·Filed 2017·Granted Dec 25, 2018·6 cites·20 claims
- 4788US2025300097A1Supporting info packages to reduce warpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4888US2025273631A1Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4987US10325865B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·3 cites·20 claims
- 5087US9831205B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 28, 2017·6 cites·20 claims
Showing the top 50 of 223 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →