Inventor · disambiguated record

Yi-Hsun Chiu

Also filed as: CHIU YI-HSUN

85 granted patents·45 pending applications·179 citations·filing 2011–2025

99Inventor score

Technology areasH10W H10D H10P H01L H01M

Files withTAIWAN SEMICONDUCTOR MFG CO LTD120 DELTA ELECTRONICS INC5 TAIWAN SEMICONDUCTOR MFG3 CHIEN TING-YING1 CHIU YI HSUN1

Top patents by PatentIndex Score

130 records

0199US11450751B2Integrated circuit structure with backside via railTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·8 cites·20 claims
0298US11563015B2Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·6 cites·20 claims
0398US11342326B2Self-aligned etch in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·6 cites·20 claims
0498US11121138B1Low resistance pickup cells for SRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·9 cites·20 claims
0598US10971505B1Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 6, 2021·5 cites·20 claims
0697US11862561B2Semiconductor devices with backside routing and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·20 claims
0797US11856762B2Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·2 cites·20 claims
0897US11532744B2Gate cut structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·4 cites·20 claims
0996US12080713B2Self-aligned etch in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·2 cites·20 claims
1096US11765878B2Semiconductor device including a layer between a source/drain region and a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
1195US11682590B2Methods of forming contact features in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·2 cites·20 claims
1295US9698261B2Vertical device architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 4, 2017·12 cites·20 claims
1393US10672665B2Fin field effect transistor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 2, 2020·6 cites·20 claims
1493US9139423B2Micro electro mechanical system structuresCHIEN TING-YING·Filed 2012·Granted Sep 22, 2015·53 cites·20 claims
1592US11658119B2Backside signal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·2 cites·20 claims
1691US11810917B2Self-aligned etch in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·1 cites·20 claims
1791US11393815B2Transistors with varying width nanosheetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 19, 2022·5 cites·20 claims
1891US10050028B2Semiconductor device with reduced leakage currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 14, 2018·8 cites·20 claims
1989US11127631B2Semiconductor device with contact structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 21, 2021·4 cites·20 claims
2088US9892224B2Method of forming masksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·5 cites·20 claims
2188US9349859B1Top metal pads as local interconnectors of vertical transistorsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 24, 2016·5 cites·20 claims
2287US12057341B2Semiconductor device with gate cut structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·1 cites·20 claims
2386US12453114B2Semiconductor transistor devices having double-sided interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
2485US2025120058A1Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2585US2025293089A1Semiconductor device with contact structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2684US12218047B2Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
2784US12113066B2Integrated circuit device including a power supply line and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
2884US10096706B2Vertical device architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 9, 2018·3 cites·20 claims
2984US2025159859A1Semiconductor Device Including a Layer Between a Source/Drain Region and a SubstrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3083US12219748B2Semiconductor device including a dielectric layer between a source/drain region and a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
3183US11404320B2Fin field effect transistor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·1 cites·20 claims
3283US9650243B2Method and apparatus for a seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·4 cites·20 claims
3383US2025324558A1Finfet sram cells with reduced fin pitchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3483US2024387530A1Integrated circuit device including a power supply line and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3582US12484254B2Integrated circuit structure with backside via railTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
3682US12327765B2Semiconductor device with contact structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 10, 2025·0 cites·20 claims
3782US12107012B2Method for forming fin field effect transistor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
3882US11521676B2SRAM structure with asymmetric interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 6, 2022·1 cites·20 claims
3982US2025241052A1Methods of forming contact features in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4082US2025364330A1Device with through via and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4181US12272605B2Methods of forming contact features in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
4281US11851325B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 26, 2023·2 cites·20 claims
4381US10361449B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·1 cites·20 claims
4480US12234145B2Methods for wafer bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
4580US12193204B2Memory devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
4680US2025359006A1Connection Between Gate Structure And Source/Drain FeatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4780US2025201296A1Separated read bl scheme in 3t dram for read speed improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4880US2025357257A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4979US12230572B2Backside signal interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
5079US11791215B2Fin field effect transistor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims

Showing the top 50 of 130 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →