Inventor · disambiguated record
Yi-Hsiang Chiu
Also filed as: CHIU YI-HSIANG
9 granted patents·14 pending applications·9 citations·filing 2011–2024
79Inventor score
Files withSONICMEMS ZHENGZHOU TECH CO LTD12J METRICS TECH CO LTD8SHIN ETSU OPTO ELECTRONIC CO LTD1TAN SIEW-SEONG1UNIV NAT CHENG KUNG1
Top patents by PatentIndex Score
23 records- 0190US11075072B2Wafer scale ultrasonic sensing device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Jul 27, 2021·3 cites·11 claims
- 0282US11460341B2Wafer scale ultrasonic sensor assembly and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2019·Granted Oct 4, 2022·3 cites·20 claims
- 0379US11806751B2Wafer level ultrasonic device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Nov 7, 2023·1 cites·4 claims
- 0476US8318526B2Manufacturing method for light-sensing structureTAN SIEW-SEONG·Filed 2011·Granted Nov 27, 2012·2 cites·23 claims
- 0574US2024009703A1Wafer level ultrasonic deviceSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 0674US2024009702A1Manufacturing method of wafer level ultrasonic deviceSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 0765US2023014827A1Wafer level ultrasonic chip module having suspension structureJ METRICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0854US10657349B2Ultrasonic module and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2018·Granted May 19, 2020·0 cites·16 claims
- 0951US11478822B2Wafer level ultrasonic chip module having suspension structure and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 1049US2025205740A1Ultrasonic component packaging structure and ultrasonic module applying sameSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2024·Application pending·0 cites
- 1149US2025076494A1Proximity ultrasonic sensing apparatus and proximity ultrasonic sensing system using the sameSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 1249US2025132713A1Transmission component assemblySONICMEMS ZHENGZHOU TECH CO LTD·Filed 2024·Application pending·0 cites
- 1348US11548031B2Array-type ultrasonic sensorSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·9 claims
- 1447US11130674B2Integrated package structure for MEMS element and ASIC chip and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·9 claims
- 1544US2020365767A1Light-emitting diode structure and method for forming the sameSHIN ETSU OPTO ELECTRONIC CO LTD·Filed 2019·Application pending·0 cites
- 1643US2023022989A1Suspended piezoelectric ultrasonic transducer and manufacturing thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2021·Application pending·0 cites
- 1743US2025208722A1Ultrasonic module and ultrasonic mouse using sameSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2024·Application pending·0 cites
- 1843US2014204175A1Image conversion method and module for naked-eye 3d displayUNIV NAT CHENG KUNG·Filed 2013·Application pending·0 cites
- 1942US2024237539A1Package structure of piezoelectric micromachined ultrasonic transducerSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 2042US2024181497A1Piezoelectric micromachined ultrasonic transducer and piezoelectric micromachined ultrasonic transducer arraySONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 2140US2025093974A1Ultrasonic mouseSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 2238US2020203319A1Mass transfer method for micro light emitting diode and light emitting panel module using thereofJ METRICS TECH CO LTD·Filed 2019·Application pending·0 cites
- 2336US11590536B2Wafer level ultrasonic chip module and manufacturing method thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →