Inventor · disambiguated record
Yi Jing Eric Chong
Also filed as: CHONG YI JING ERIC
1 granted patent·3 pending applications·0 citations·filing 2023–2024
11Inventor score
Files withSTATS CHIPPAC PTE LTD4
Top patents by PatentIndex Score
4 records- 0156US12417939B2Semiconductor device and method of detecting semiconductor wafer centered on tapeSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 16, 2025·0 cites·25 claims
- 0251US2025219006A1Semiconductor Device and Method of Making a Chip-on-Wafer Underfill BarrierSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0350US2025118643A1Semiconductor Device and Method of Inhibiting Creep of Underfill Material on Back Surface of Semiconductor DieSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0449US2025006608A1Semiconductor Device and Method of Forming Inverted EWLB Package with Vertical E-Bar StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →