Inventor · disambiguated record
Yi-Hsien Chou
Also filed as: CHOU YI-HSIEN
7 granted patents·2 pending applications·1 citations·filing 2019–2024
70Inventor score
Top patents by PatentIndex Score
9 records- 0187US12272672B2Semiconductor device with hollow interconnectorsNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 8, 2025·1 cites·11 claims
- 0272US12249576B2Semiconductor device structure with stacked conductive plugs and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted Mar 11, 2025·0 cites·9 claims
- 0361US12237260B2Semiconductor device structure with stacked conductive plugs and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Feb 25, 2025·0 cites·6 claims
- 0458US11876074B2Semiconductor device with hollow interconnectorsNANYA TECHNOLOGY CORP·Filed 2021·Granted Jan 16, 2024·0 cites·6 claims
- 0549US11088254B2Semiconductor device and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Aug 10, 2021·0 cites·11 claims
- 0648US11437370B2Semiconductor device with multiple threshold voltages and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 6, 2022·0 cites·18 claims
- 0747US11232952B2Semiconductor device structure with fine patterns and method for forming the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Jan 25, 2022·0 cites·18 claims
- 0836US2021020635A1Semiconductor structure and method of formationNANYA TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 0935US2020173842A1Mobile vibration detecting device and detecting method thereofTECOM CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →