Inventor · disambiguated record
Yinon Degani
Also filed as: DEGANI YINON
57 granted patents·10 pending applications·3,884 citations·filing 1989–2021
99Inventor score
Files withLUCENT TECHNOLOGIES INC23DEGANI YINON9SYCHIP INC9AT & T BELL LAB8AGERE SYST GUARDIAN CORP6
Top patents by PatentIndex Score
67 records- 0198US5646828AThin packaging of multi-chip modules with enhanced thermal/power managementLUCENT TECHNOLOGIES INC·Filed 1996·Granted Jul 8, 1997·359 cites·5 claims
- 0298US5608262APackaging multi-chip modules without wire-bond interconnectionLUCENT TECHNOLOGIES INC·Filed 1995·Granted Mar 4, 1997·449 cites·15 claims
- 0397US8102021B2RF devicesDEGANI YINON·Filed 2008·Granted Jan 24, 2012·238 cites·8 claims
- 0497US6734539B2Stacked module packageLUCENT TECHNOLOGIES INC·Filed 2001·Granted May 11, 2004·227 cites·17 claims
- 0596US6678167B1High performance multi-chip IC packageAGERE SYSTEMS INC·Filed 2000·Granted Jan 13, 2004·109 cites·10 claims
- 0696US6437990B1Multi-chip ball grid array IC packagesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 20, 2002·110 cites·7 claims
- 0796US6433411B1Packaging micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 13, 2002·113 cites·16 claims
- 0896US5346118ASurface mount solder assembly of leadless integrated circuit packages to substratesAT & T BELL LAB·Filed 1993·Granted Sep 13, 1994·243 cites·20 claims
- 0994US6154370ARecessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Nov 28, 2000·117 cites·7 claims
- 1094US5869894ARF IC packageLUCENT TECHNOLOGIES INC·Filed 1997·Granted Feb 9, 1999·180 cites·7 claims
- 1194US5473512AElectronic device package having electronic device boonded, at a localized region thereof, to circuit boardAT & T CORP·Filed 1994·Granted Dec 5, 1995·170 cites·29 claims
- 1293US6396711B1Interconnecting micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 28, 2002·115 cites·12 claims
- 1393US6013877ASolder bonding printed circuit boardsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 11, 2000·124 cites·15 claims
- 1490US6175158B1Interposer for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 16, 2001·115 cites·19 claims
- 1590US5904859AFlip chip metallizationLUCENT TECHNOLOGIES INC·Filed 1997·Granted May 18, 1999·77 cites·11 claims
- 1689US7355264B2Integrated passive devices with high Q inductorsSYCHIP INC·Filed 2006·Granted Apr 8, 2008·34 cites·21 claims
- 1789US6130141AFlip chip metallizationLUCENT TECHNOLOGIES INC·Filed 1998·Granted Oct 10, 2000·101 cites·8 claims
- 1887US7382056B2Integrated passive devicesSYCHIP INC·Filed 2005·Granted Jun 3, 2008·20 cites·20 claims
- 1986US7692511B2Compact balun transformersSYCHIP INC·Filed 2008·Granted Apr 6, 2010·16 cites·17 claims
- 2086US6232212B1Flip chip bump bondingLUCENT TECHNOLOGIES INC·Filed 1999·Granted May 15, 2001·86 cites·15 claims
- 2185US6074897AIntegrated circuit bonding method and apparatusLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jun 13, 2000·79 cites·11 claims
- 2282US7259077B2Integrated passive devicesSYCHIP INC·Filed 2004·Granted Aug 21, 2007·23 cites·12 claims
- 2382US4973126AOptical fiber connectorAT & T BELL LAB·Filed 1989·Granted Nov 27, 1990·54 cites·7 claims
- 2481US5990564AFlip chip packaging of memory chipsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Nov 23, 1999·61 cites·16 claims
- 2580US6100475ASolder bonding printed circuit boardsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Aug 8, 2000·51 cites·13 claims
- 2679US5564617AMethod and apparatus for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Oct 15, 1996·51 cites·19 claims
- 2778US6680212B2Method of testing and constructing monolithic multi-chip modulesLUCENT TECHNOLOGIES INC·Filed 2001·Granted Jan 20, 2004·24 cites·14 claims
- 2878US4946236AMovable fiber optical switchAT & T BELL LAB·Filed 1989·Granted Aug 7, 1990·38 cites·34 claims
- 2977US5150832ASolder pasteAT & T BELL LAB·Filed 1991·Granted Sep 29, 1992·35 cites·10 claims
- 3076US6369444B1Packaging silicon on silicon multichip modulesAGERE SYST GUARDIAN CORP·Filed 1998·Granted Apr 9, 2002·47 cites·12 claims
- 3175US6160715ATranslator for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 12, 2000·39 cites·18 claims
- 3274US6077725AMethod for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1992·Granted Jun 20, 2000·42 cites·23 claims
- 3372US5382300ASolder paste mixtureAT & T CORP·Filed 1994·Granted Jan 17, 1995·33 cites·20 claims
- 3471US6597069B1Flip chip metallizationLUCENT TECHNOLOGIES INC·Filed 2000·Granted Jul 22, 2003·16 cites·1 claims
- 3571US6015652AManufacture of flip-chip deviceLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 18, 2000·45 cites·23 claims
- 3668US6370766B1Manufacture of printed circuit cardsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Apr 16, 2002·30 cites·9 claims
- 3767US7936043B2Integrated passive device substratesSYCHIP INC·Filed 2006·Granted May 3, 2011·4 cites·5 claims
- 3863US6251705B1Low profile integrated circuit packagesAGERE SYSTEMS INC·Filed 1999·Granted Jun 26, 2001·27 cites·12 claims
- 3962US6342399B1Testing integrated circuitsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jan 29, 2002·22 cites·8 claims
- 4059US6043670AMethod for testing integrated circuitsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Mar 28, 2000·20 cites·21 claims
- 4158US7795709B2Shielding noisy conductors in integrated passive devicesSYCHIP INC·Filed 2007·Granted Sep 14, 2010·2 cites·9 claims
- 4256US5125560AMethod of soldering including removal of flux residueAT & T BELL LAB·Filed 1991·Granted Jun 30, 1992·24 cites·6 claims
- 4355US5516728AProcess for fabircating an integrated circuitAT & T CORP·Filed 1994·Granted May 14, 1996·24 cites·23 claims
- 4454US7170754B2SDIO memory and interface cardSYCHIP INC·Filed 2004·Granted Jan 30, 2007·8 cites·11 claims
- 4554US5385290ASoldering material and procedureAT & T CORP·Filed 1993·Granted Jan 31, 1995·14 cites·5 claims
- 4653US5211764ASolder paste and method of using the sameAT & T BELL LAB·Filed 1992·Granted May 18, 1993·13 cites·16 claims
- 4752US8018027B2Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductorMURATA MANUFACTURING CO·Filed 2009·Granted Sep 13, 2011·3 cites·7 claims
- 4850US5037476AProcess for improving photostability of titanium dioxide pigments in binder compositions without decreasing reflectivityAT & T BELL LAB·Filed 1990·Granted Aug 6, 1991·9 cites·2 claims
- 4950US2009218655A1Integrated passive devicesDEGANI YINON·Filed 2009·Application pending·0 cites
- 5048US5778913ACleaning solder-bonded flip-chip assembliesLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jul 14, 1998·13 cites·7 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →